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1 sheet no.: d1-a00601en date: may 30, 2007 ?sharp corporation gl100mn0mpx gl100mn0mpx surface mount type, infrared emitting diode notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the la test device specification sheets before usin g any sharp device. features 1. compact and thin smd package 2. top view and side view mountable 3. plastic mold with resin lens 4. peak emission wavelength: 940 nm typ. 5. narrow directivity angle ( ? : 10 typ.) 6. lead free and rohs directive compliant model line-up agency approvals/compliance 1. compliant with rohs directive (2002/95/ec) 2. content information about the six substances specified in ?management methods for control of pollution caused by electronic information prod- ucts regulation? (popular name: china rohs) (chinese: ); refer to page 7. applications 1. office automation equipment 2. audio visual equipment 3. home appliances 4. telecommunication equipment 5. measuring equipment 6. tooling machines 7. computers model no. packaging mount direction gl100mn0mp 2000 pcs/reel side view GL100MN0MP1 1500 pcs/reel top view
sheet no.: d1-a00601en 2 gl100mn0mpx external dimensions 3.0 2.2 0.95 (0.4) 3.0 3.0 1.5 1.5 1.1 1.1 1.4 0.85 1.7 1.1 1.1 1.5 1.5 (0.2) (0.35) 0.4 2.2 1.0 (0.65) 0.75 r0.8 (0.57) (1.0) (1.0) (0.57) notes: 1. unit: mm 2. unspecified tolerance : 0.2 mm 3. ( ) : reference dimensions 4. a u -plated area 5. do not allo w circ u it r u ns in area (lens center) vie w ed from pcb (side v ie w mo u nting) vie w ed from pcb (top v ie w mo u nting) 1 1 1 2 2 2 anode cathode no. name 0.65 pin arran g ement
sheet no.: d1-a00601en 3 gl100mn0mpx absolute maximum ratings * 1 pulse width: 100 s, duty ratio: 0.01 * 2 within 10 s (max.) see fig. 10. electro-optical charactertistics parameter symbol rating unit forward current i f 50 ma peak pulsed forward current *1 i fm 0.5 a reverse voltage v r 6 v power dissipation p 75 mw operating temperature topr -30 to + 8 5c storage temperature tstg -40 to+ 95 c soldering temperature *2 tsol 240 c parameter symbol conditions min. typ. max. unit forward voltage v f i f = 20 ma ? 1.2 1.4 v peak forward voltage v fm i fm = 0.5 a ? 3.0 4.0 v reverse current i r v r = 3 v ??10a radiant intensity e i f = 20 ma 1.0 ? 3.0 mw peak emission wavelength pi f = 5 ma ? 940 ? nm half intensity wavelength ? i f = 5 ma ? 45 ? nm terminal capacitance c t v r = 0, f = 1 mhz ? 50 ? pf response frequency f c ? ? 300 ? khz half-intensity angle ? ? ? 10 ? degrees fig. 1 forward current vs. ambient temperature 0 10 20 30 40 50 60 -50 -25 0 25 50 75 100 am b ient temperat u re t a (c) for w ard c u rrent i f (ma) -30 85 fig. 2 peak forward current vs. duty ratio 10 100 1000 10000 d u ty ratio peak for w ard c u rrent i fm (ma) 10 -4 10 -3 10 -2 10 -1 10 0 p u lse w idth 100 s ta = 25c (ta = 25c) (ta = 25c)
sheet no.: d1-a00601en 4 gl100mn0mpx fig. 3 spectral distribution fig. 4 peak emission wavelength vs. ambient temperature relati v e radiant intensity (%) 0 20 40 60 80 100 860 900 940 980 1020 880 920 960 1000 1040 w a v elength (nm) i f = 5 ma t a = 25c 920 930 940 950 960 970 980 -50 -25 -30 0 25 50 75 85 100 peak emission w a v elength p (nm) am b ient temperat u re t a (c) i f = constant fig. 5 forward curren t vs. forw ard voltage fig. 6 relative radiant flux vs. ambient temperature for w ard c u rrent i f (ma) 0.1 1 10 100 1000 0 0.5 1 1.5 2 2.5 3 for w ard v oltage v f (v) 50c 0c ? 30c 25c t a = 85c i f = constant relati v e radiant fl u x (%) 0.1 1 10 -50 -25 -30 0 25 50 85 75 100 am b ient temperat u re t a (c)
sheet no.: d1-a00601en 5 gl100mn0mpx fig. 7 radiant flux vs. forward current fig. 8 relative output vs. distance to detector 0.01 100 10 1 0.1 1 100 10 1000 t a = 25c radiant fl u x e (m w ) for w ard c u rrent i f (ma) p u lse (p u lse w idth 100 m s) relati v e o u tp u t (%) 0.01 0.1 1 10 100 0.1 1 10 100 1000 (detector: pt100mf0mp) distance to detector (mm) i f = constant t a = 25c fig. 9 radiation diagram relati v e radiant intensity (%) 100 80 60 40 20 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 +10 +20 +30 +40 +50 +60 +70 +80 +90 ang u lar displacement
sheet no.: d1-a00601en 6 gl100mn0mpx design considerations design guidelines 1. allow for natural degradation of th e led as a result of long continuou s operation. this part will have 50 % deg- radation in output after 5 years of continuous use. 2. this product is not designed to be electroma gnetic- and ionized-particle-radiation resistant. manufacturing guidelines soldering instructions 1. sharp recommends soldering no more than once when using solder reflow methods. 2. when using solder reflow methods, follow the reflow soldering temperature profile shown in fig. 10. sharp recommends checking the process to make sure these parameters are not exceeded; exceeding these param- eters can cause substrate bending or other mechanical stre sses leading to debonding of the internal gold wires, or other similar failure modes. 3. if using an infrared lamp to preheat the parts, such heat sources may cause localized high temperatures in the part's resin. be sure to keep the temperature profile within the guidelines shown in fig. 10. 4. if hand soldering, use temperatures 260 for 3 seconds. do not dip-solder or v ps-solder this part. 5. do not subject the package to excessive mechanical force during soldering as it may cause deformation or defects in plated connections. internal connections may be severed due to mechanical force placed on the pack- age due to the pcb flexing during the soldering process. cleaning instructions 1. confirm this device's resistance to process chemicals be fore use, as certain process chemicals may affect the optical characteristics. 2. solvent cleaning: solvent temperature should be 45c or below. immersion time should be 3 minutes or less. 3. ultrasonic cleaning: the effect upon devices varies d ue to cleaning bath size, ultrasonic power output, cleaning time, pcb size and device mounting circumstances. sharp recommends testing using actual production condi- tions to confirm the harmlessness of the ultrasonic cleaning methods. 4. recommended solvent materials: ethyl alcohol, methyl alcohol, and isopropyl alcohol. fig. 10 reflow solderi ng temperature profile 200c 25c 240c max. 120 s max. 90 s max. 60 s max. 10 s max. 165c max. 1 ~ 4 c/s 1 ~ 4 c/s 1 ~ 4c/s
sheet no.: d1-a00601en 7 gl100mn0mpx storage and handling 1. store these parts between 5c and 30c, at a relative humidity of less than 70 % . 2. after breaking the package seal, maintain the environment within 5c to 25c, at a relative humidity of less than 60 % , and mount the parts within two days. if unable to do so, bake before mounting. 3. when storing the parts after breaking the seal, sharp recommends storage of no longer than two weeks in a dry box or by resealing the parts in a moisture-proof bag with a desiccant. if unable to do so, bake before mounting. 4. when baking the parts before mounting, sharp recommends baking the parts only once and only if in a metal tray or mounted on a pcb. recommended conditions are for 16 to 24 hours, at a temperature of 125c. presence of odcs (rohs compliance) this product shall not contain the following materials, and they are not used in the production process for this product: ? regulated substances: cfcs, halon, carbon tetrachlor ide, 1,1,1-trichloroethane (methylchloroform). specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ? lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated diphenyl ethers (pbde). ? content information about the six substances specified in ?management methods for control of pollution caused by electronic informatio n products regulation? (chinese: ) note: ? indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the conc entration limit requirement as described in sj/t 11363-2006 standard. taping specifications 1. tape structure and dimensions conforms to those shown in fig. 11 to fig. 16. 2. product insertion will have the catho de to the hole si de of the tape. 3. cover tape peel-separation force: f = 0.2 to 1.0 n (where 160 to 1 8 0) 4. quantity per reel = 2000 pcs. (gl100mn0mp) or 1500 pcs. (GL100MN0MP1) 5. product mass: 0.01 g (approx.) 6. packaging: a. reels are sealed inside an aluminum bag, along with a humidity indicator card. b. bags are labeled and securely packed. category toxic and hazdardous substances lead (pb) mercury (hg) cadmium (cd) hexavalent chromiun (cr 6+ ) polybrominated biphenyls (pbb) polybrominated diphenyl ethers (pbde) infrared emitting diode ??????
sheet no.: d1-a00601en 8 gl100mn0mpx packing specifications gl100mn0mp (side view mount, 2000 pcs/reel) fig. 11 tape shape and dimension fig. 12 reel shape and dimension 4.0 0.1 2.0 0.05 4.0 0.1 1.6 0.1 2.5 0.1 1.75 0.1 0.3 0.05 5.5 0.1 5 3.5 0.05 8.0 0.3 1.75 0.1 1.5 +0.1 -0 3.3 0.1 1.7 0.1 180.0 note: unit: mm 11.4 1 2.0 0.5 13.0 0.2 9.0 +0.3 -0 60.0 +1 -0
sheet no.: d1-a00601en 9 gl100mn0mpx GL100MN0MP1 (top view mount, 1500 pcs/reel) fig. 13 product insertion direction fig. 14 tape shape and dimension p u ll-o u t direction 4.0 0.1 2.0 0.05 4.0 0.1 1.8 0.1 2.45 0.1 0.3 0.05 5.5 0.1 5 3.5 0.05 8.0 0.3 1.75 0.1 3.3 0.1 1.5 +0.1 -0
sheet no.: d1-a00601en 10 gl100mn0mpx fig. 15 reel shape and dimension fig. 16 product insertion direction 180.0 note: unit: mm 11.4 1 2.0 0.5 13.0 0.2 9.0 +0.3 -0 60.0 +1 -0 p u ll-o u t direction
important notices the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp?s devices. contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristi cs, data materials, struc- ture, and other contents described herein at any time without notice in order to im prove design or reliability. manufacturing locations are also subject to change without notice. observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment (terminal) --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to en sure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliabilty such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- v arious safety devices, etc. (iii) sharp devices shall not be used for or in connec- tion with equipment that requires an extremely high level of reliability an d safety such as: --- space applications --- telecommunication equipment (trunk lines) --- nuclear power control equipment --- medical and other life support equipment (e.g. scuba) if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. contact and consult with a sharp representative if there are any questions about the contents of this pub- lication. sheet no.: d1-a00601en 11 gl100mn0mpx

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